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How do carbon nanotubes fit into the semiconductor roadmap?

How do carbon nanotubes fit into the semiconductor roadmap? This paper presents an overview of the issues related to the integration of carbon nanotubes into microelectronics systems. Particular emphasis is placed on the use of carbon nanotubes as on-chip wiring (interconnects) and active devices (transistors), the two main building blocks of current semiconductor circuits. The properties of state-of-the art devices are compared in order to test the viability of replacing silicon-based components with carbon nanotubes. Further, the problems associated with the construction of nanotube-based devices are discussed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Applied Physics A: Materials Science Processing Springer Journals

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References (39)

Publisher
Springer Journals
Copyright
Copyright © 2005 by Springer-Verlag
Subject
Physics; Condensed Matter Physics; Optical and Electronic Materials; Nanotechnology; Characterization and Evaluation of Materials; Surfaces and Interfaces, Thin Films; Operating Procedures, Materials Treatment
ISSN
0947-8396
eISSN
1432-0630
DOI
10.1007/s00339-004-3151-7
Publisher site
See Article on Publisher Site

Abstract

This paper presents an overview of the issues related to the integration of carbon nanotubes into microelectronics systems. Particular emphasis is placed on the use of carbon nanotubes as on-chip wiring (interconnects) and active devices (transistors), the two main building blocks of current semiconductor circuits. The properties of state-of-the art devices are compared in order to test the viability of replacing silicon-based components with carbon nanotubes. Further, the problems associated with the construction of nanotube-based devices are discussed.

Journal

Applied Physics A: Materials Science ProcessingSpringer Journals

Published: Mar 1, 2005

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