Technology of the fabrication of multilayer structures with controllable adhesion interaction between metal films composing these structures is considered. Control of adhesion interaction was attained by modifying the surface of corresponding metal film until an adhesion bond appeared in vacuum and by changing technological parameters. The adhesion strength was evaluated by the temperature of structure splitting due to the difference in the coefficients of thermal expansion of the substrate and ultimate metal electrode. The analysis of surfaces prior to and after structure splitting was carried out optically using the Michelson interferometer.
Russian Microelectronics – Springer Journals
Published: Sep 27, 2007
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