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/lp/springer-journals/a-uv-curable-epoxy-with-soft-segments-for-3d-printable-shape-memory-JHPBQJxTab
- Publisher
- Springer Journals
- Copyright
- Copyright © 2018 by Springer Science+Business Media, LLC, part of Springer Nature
- Subject
- Materials Science; Materials Science, general; Characterization and Evaluation of Materials; Polymer Sciences; Continuum Mechanics and Mechanics of Materials; Crystallography and Scattering Methods; Classical Mechanics
- ISSN
- 0022-2461
- eISSN
- 1573-4803
- DOI
- 10.1007/s10853-018-2520-0
- Publisher site
- See Article on Publisher Site
Abstract
Three-dimensional (3D)-printable shape-memory polymers (SMPs) are of great interest for making advanced shape-memory materials. However, it has been challenging to combine 3D-printable capability with shape-memory function into one material. Here, we report a UV-curable epoxy with excellent shape-memory performance and improved toughness as compared with traditional epoxy counterpart. The epoxy system is realized by cross-linking epoxy resin diglycidyl ether of bisphenol F (DGEBF) (“hard” segments) with toughening agent 3-ethyl-3-oxetanemethanol (TMPO) (“soft” segments), which finally creates a three-dimensional network with TMPO-co-DGEBF block structures. The fold-deploy tests show that the shape fixity ratio (R f) and the shape recovery ratio (R r) of the epoxy with 50 wt% TMPO soft segment are above 97 and 99% even after 20 cycles of testing, respectively. In addition to bringing shape-memory performance, the toughness of the epoxy system is notably improved by the TMPO soft segments. This study provides a very promising epoxy system for 3D-printable shape-memory materials.
Journal
Journal of Materials Science – Springer Journals
Published: Jun 6, 2018
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