Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

A Guide to Lead-free SoldersPackaging Architecture and Assembly Technology

A Guide to Lead-free Solders: Packaging Architecture and Assembly Technology Chapter 2 Dongil Kwon Chapter 1 reviewed the variety of solder alloys and the general properties and be- havior of these materials in relation to their role in electronic product life. We now investigate in more detail the architecture of electronic hardware. This will help us to understand the important role of solder alloys in product reliability. Clearly, the transition to lead-free soldering presents several challenges in structure and proc- esses. Lead finishes, elements of the BGA and other emerging area-array technolo- gies must change and yet remain compatible with processes. Changes in solder paste and flux must also be evaluated. We begin our discussion with the structural elements of packages that are most closely related to the solder joint. 2.1 Packaging Architectures In general, an electronic product can be considered as an interconnection hierar- chy, from the basic semiconductor to the printed wiring assemblies that make up the functional circuits of a product. As discussed in Chapter 1, various types of assemblies can be created and technology is making possible increased perform- ance and functionality in ever-smaller product volumes. Packaging architectures range from leaded devices assembled to printed wiring boards by wave-soldering technology to ball-grid arrays and chip-scale http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png

A Guide to Lead-free SoldersPackaging Architecture and Assembly Technology

Editors: Engelmaier, Werner
Kwon, Dongil
A Guide to Lead-free Solders — Jan 1, 2007
Download PDF
22 pages

Loading next page...
 
/lp/springer-journals/a-guide-to-lead-free-solders-packaging-architecture-and-assembly-oBu04oxnlo

References (44)

Publisher
Springer London
Copyright
© Springer-Verlag London Limited 2007
ISBN
978-1-84628-309-3
Pages
29 –51
DOI
10.1007/978-1-84628-310-9_2
Publisher site
See Chapter on Publisher Site

Abstract

Chapter 2 Dongil Kwon Chapter 1 reviewed the variety of solder alloys and the general properties and be- havior of these materials in relation to their role in electronic product life. We now investigate in more detail the architecture of electronic hardware. This will help us to understand the important role of solder alloys in product reliability. Clearly, the transition to lead-free soldering presents several challenges in structure and proc- esses. Lead finishes, elements of the BGA and other emerging area-array technolo- gies must change and yet remain compatible with processes. Changes in solder paste and flux must also be evaluated. We begin our discussion with the structural elements of packages that are most closely related to the solder joint. 2.1 Packaging Architectures In general, an electronic product can be considered as an interconnection hierar- chy, from the basic semiconductor to the printed wiring assemblies that make up the functional circuits of a product. As discussed in Chapter 1, various types of assemblies can be created and technology is making possible increased perform- ance and functionality in ever-smaller product volumes. Packaging architectures range from leaded devices assembled to printed wiring boards by wave-soldering technology to ball-grid arrays and chip-scale

Published: Jan 1, 2007

Keywords: Solder Joint; Solder Alloy; Whisker Growth; Flip Chip; Fine Pitch

There are no references for this article.