High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method

High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation... PurposeThis paper aims to investigate the creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The creep constitutive modelling was developed. Meanwhile, the creep mechanism of the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints was discussed.Design/methodology/approachThe creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K were investigated using the nanoindentation method.FindingsThe results of the experiments showed that the indentation depth and area increased with increasing temperatures. At the test temperature of 298-358 K, the creep strain rate of the bulks of the micro solder joints increases with the rising of the tested temperature. The values of creep stress exponent and activation energy calculated for the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints were reasonably close to the published data. At the tested temperatures, dislocation climb took place and the dislocation climb motion was controlled by the dislocation pipe mechanism, and the second-phase particles enhancement mechanism played a very important role.Originality/valueThis study provides the creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints at different temperatures. The creep constitutive modelling has been developed for low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method

Loading next page...
 
/lp/emerald/high-temperature-creep-properties-of-low-ag-cu-sn-ag-cu-bi-ni-cu-LBCFAxrTdX
Publisher
Emerald Group Publishing Limited
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
D.O.I.
10.1108/SSMT-01-2016-0001
Publisher site
See Article on Publisher Site

Abstract

PurposeThis paper aims to investigate the creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The creep constitutive modelling was developed. Meanwhile, the creep mechanism of the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints was discussed.Design/methodology/approachThe creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K were investigated using the nanoindentation method.FindingsThe results of the experiments showed that the indentation depth and area increased with increasing temperatures. At the test temperature of 298-358 K, the creep strain rate of the bulks of the micro solder joints increases with the rising of the tested temperature. The values of creep stress exponent and activation energy calculated for the bulks of Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints were reasonably close to the published data. At the tested temperatures, dislocation climb took place and the dislocation climb motion was controlled by the dislocation pipe mechanism, and the second-phase particles enhancement mechanism played a very important role.Originality/valueThis study provides the creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints at different temperatures. The creep constitutive modelling has been developed for low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jun 6, 2016

There are no references for this article.

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Search

Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly

Organize

Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.

Access

Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

DeepDyve

Freelancer

DeepDyve

Pro

Price

FREE

$49/month
$360/year

Save searches from
Google Scholar,
PubMed

Create lists to
organize your research

Export lists, citations

Read DeepDyve articles

Abstract access only

Unlimited access to over
18 million full-text articles

Print

20 pages / month

PDF Discount

20% off