A review: lead free solder and its wettability properties

A review: lead free solder and its wettability properties PurposeThe purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability.Design/methodology/approachThis paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder.FindingsThis paper also reviews on the lead free solder characteristics that focused on its wettability.Originality/valueThis paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

A review: lead free solder and its wettability properties

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Publisher
Emerald Group Publishing Limited
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
D.O.I.
10.1108/SSMT-08-2015-0022
Publisher site
See Article on Publisher Site

Abstract

PurposeThe purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability.Design/methodology/approachThis paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder.FindingsThis paper also reviews on the lead free solder characteristics that focused on its wettability.Originality/valueThis paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jun 6, 2016

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