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/lp/emerald-publishing/xps-and-afm-investigations-on-silverbased-photoimageable-thick-film-LvRVVrl7Mi
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565360810846653
- Publisher site
- See Article on Publisher Site
Abstract
Purpose The purpose of this paper is to ascertain chemical changes occurring at various stages involved in processing of silverbased photoimageable thick films and to determine ensuing topographical features which other wise appeared to be hindered in 2D scanning electron microscopy.Designmethodologyapproach Surface sensitive techniques, viz. Xray photoelectron spectroscopy XPS and atomic force microscopy AFM were used.Findings Interfacial adhesion of silver film with substrate Al2O3 was specifically looked into with respect to role played by photoimaging before and after exposure to ultraviolet light. XPS results revealed occurrence of subtle chemical changes in terms of unsaturation to saturation in CC bonding and also an interesting CAl bonding which presumably improves mechanical adhesion of unfired film with the alumina substrate. AFM was carried out to examine the surface roughness, particle size, and microstructure of film which are very important from the standpoint of highfrequency applications.Originalityvalue Surface sensitive techniques like XPS and AFM were exclusively used in order to characterize silverbased photoimageable thick films.
Journal
Microelectronics International – Emerald Publishing
Published: Dec 28, 2007