Purpose This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.Designmethodologyapproach Dozens of journal articles, conference articles and patents published or issued in 20042007 are reviewed.Findings The advantages and problemschallenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findingsdevelopments related to wire bonding using insulated wire are discussed.Research limitationsimplications Because of page limitation of the paper, only brief review is conducted. Further reading is needed for more details.Originalityvalue This paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents.
Microelectronics International – Emerald Publishing
Published: Apr 18, 2008