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Wire bonding using insulated wire and new challenges in wire bonding

Wire bonding using insulated wire and new challenges in wire bonding Purpose This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.Designmethodologyapproach Dozens of journal articles, conference articles and patents published or issued in 20042007 are reviewed.Findings The advantages and problemschallenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findingsdevelopments related to wire bonding using insulated wire are discussed.Research limitationsimplications Because of page limitation of the paper, only brief review is conducted. Further reading is needed for more details.Originalityvalue This paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Wire bonding using insulated wire and new challenges in wire bonding

Microelectronics International , Volume 25 (2): 6 – Apr 18, 2008

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360810875958
Publisher site
See Article on Publisher Site

Abstract

Purpose This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.Designmethodologyapproach Dozens of journal articles, conference articles and patents published or issued in 20042007 are reviewed.Findings The advantages and problemschallenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findingsdevelopments related to wire bonding using insulated wire are discussed.Research limitationsimplications Because of page limitation of the paper, only brief review is conducted. Further reading is needed for more details.Originalityvalue This paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents.

Journal

Microelectronics InternationalEmerald Publishing

Published: Apr 18, 2008

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