Purpose The purpose of this paper is to review recent advances in wire bonding of lowk devices.Designmethodologyapproach Dozens of journal and conference articles published in 20052008 are reviewed.Findings The paper finds that many articles have discussed and analysed problemschallenges such as bond pad metal peelinglift, nonsticking on pad, decreased bonding strength and lower wirebond assembly yield. The paper discusses the articles' solutions to the problems and recent findingsdevelopments in wire bonding of lowk devices.Research limitationsimplications Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originalityvalue The paper attempts to provide an introduction to recent developments and the trends in wire bonding of lowk devices. With the references provided, readers may explore more deeply by reading the original articles.
Microelectronics International – Emerald Publishing
Published: Jul 25, 2008
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