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Waterrinsable or socalled No Clean Solder Pastes The Attempt of a Comparison from the Technical and Environmental Viewpoint

Waterrinsable or socalled No Clean Solder Pastes The Attempt of a Comparison from the Technical... In SMD as well as in hybrid manufacturing processes, considerable quantities of CFC are still being used in 1991 for the cleaning of component groups. The second BlmSchV, as amended, status at 12 December 1990, prohibits the use of R113 for surface treatment plants as of 31 December 1992. Pursuant to developments in solder pastes, some products are already available which render the use of CFCs superfluous. Two methods in particular are emerging, which work either completely without cleaning or use water as a cleaning medium. A critical comparison is made of the properties of the relevant solder pastes in these categories. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Waterrinsable or socalled No Clean Solder Pastes The Attempt of a Comparison from the Technical and Environmental Viewpoint

Soldering & Surface Mount Technology , Volume 4 (1): 3 – Jan 1, 1992

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037778
Publisher site
See Article on Publisher Site

Abstract

In SMD as well as in hybrid manufacturing processes, considerable quantities of CFC are still being used in 1991 for the cleaning of component groups. The second BlmSchV, as amended, status at 12 December 1990, prohibits the use of R113 for surface treatment plants as of 31 December 1992. Pursuant to developments in solder pastes, some products are already available which render the use of CFCs superfluous. Two methods in particular are emerging, which work either completely without cleaning or use water as a cleaning medium. A critical comparison is made of the properties of the relevant solder pastes in these categories.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jan 1, 1992

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