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Utilizing thermal fatigue testing to differentiate the performance of epoxy materials at various glass transition temperature levels

Utilizing thermal fatigue testing to differentiate the performance of epoxy materials at various... A common method for understanding the thermal performance of epoxy laminate materials is to analyze the glass transition temperature using instruments such as differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA). In order to characterize the long‐term performance of a finished printed circuit board, more advanced reliable test methods have been developed. This paper will discuss interconnect stress testing (IST), an accelerated fatigue test used for evaluating the failure modes of a printed circuit board (PCB) interconnect. IST utilizes a DC current to heat the PCB to the recommended temperatures within the interconnect. The plated through hole integrity and the post‐interconnect integrity can be monitored simultaneously. The test matrix compares the performance of various AlliedSignal epoxy laminate materials as a function of glass transition temperature (Tg) and board design. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Utilizing thermal fatigue testing to differentiate the performance of epoxy materials at various glass transition temperature levels

Kathleen M. Reutzel
Circuit World , Volume 26 (1): 3 – Mar 1, 2000
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References (2)

Publisher
Emerald Publishing
Copyright
Copyright © 2000 MCB UP Ltd. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120010302151
Publisher site
See Article on Publisher Site

Abstract

A common method for understanding the thermal performance of epoxy laminate materials is to analyze the glass transition temperature using instruments such as differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA). In order to characterize the long‐term performance of a finished printed circuit board, more advanced reliable test methods have been developed. This paper will discuss interconnect stress testing (IST), an accelerated fatigue test used for evaluating the failure modes of a printed circuit board (PCB) interconnect. IST utilizes a DC current to heat the PCB to the recommended temperatures within the interconnect. The plated through hole integrity and the post‐interconnect integrity can be monitored simultaneously. The test matrix compares the performance of various AlliedSignal epoxy laminate materials as a function of glass transition temperature (Tg) and board design.

Journal

Circuit World – Emerald Publishing

Published: Mar 1, 2000

Keywords: Thermal stress; Epoxy coatings; Thermal performance; Printed circuit boards

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