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Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters

Useful lifetime estimation of solder joints in power semiconductors employed in current source... The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.Design/methodology/approachIn this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.FindingsIt was found that inverter types highly affect the solder joint health during its nominal operating.Originality/valueThe authors confirm the originality of this paper. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters

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Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0954-0911
DOI
10.1108/ssmt-05-2020-0018
Publisher site
See Article on Publisher Site

Abstract

The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.Design/methodology/approachIn this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.FindingsIt was found that inverter types highly affect the solder joint health during its nominal operating.Originality/valueThe authors confirm the originality of this paper.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: May 17, 2021

Keywords: Sn-Ag-Cu; Solder joints; Thermal fatigue; Useful lifetime

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