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Through silicon vias: from a physical point of view to a compact models initiation

Through silicon vias: from a physical point of view to a compact models initiation Purpose – The substrate coupling and loss in integrated circuits are analyzed. Then, the authors extract impedances between any numbers of embedded contacts. The paper aims to discuss these issues. Design/methodology/approach – The paper proposes a new substrate network 3D extraction technique, adapted from a transmission line method or Green kernels, but in the whole volume. Findings – Extracting impedances between any numbers of embedded contacts with variable shapes or/and through silicon via. This 3D method is much faster comparing with FEM Originality/value – Previous works consider TSVs alone, contacts onto the substrate. The authors do study entanglement between the substrate and the interconnections. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering Emerald Publishing

Through silicon vias: from a physical point of view to a compact models initiation

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Publisher
Emerald Publishing
Copyright
Copyright © 2014 Emerald Group Publishing Limited. All rights reserved.
ISSN
0332-1649
DOI
10.1108/COMPEL-06-2013-0201
Publisher site
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Abstract

Purpose – The substrate coupling and loss in integrated circuits are analyzed. Then, the authors extract impedances between any numbers of embedded contacts. The paper aims to discuss these issues. Design/methodology/approach – The paper proposes a new substrate network 3D extraction technique, adapted from a transmission line method or Green kernels, but in the whole volume. Findings – Extracting impedances between any numbers of embedded contacts with variable shapes or/and through silicon via. This 3D method is much faster comparing with FEM Originality/value – Previous works consider TSVs alone, contacts onto the substrate. The authors do study entanglement between the substrate and the interconnections.

Journal

COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering – Emerald Publishing

Published: Jul 1, 2014

Keywords: Algorithms; Analytical methods; Applied electromagnetics; CAD; 3D FEM; Circuit analysis

References

  • The Transmission‐Line Modeling Method: TLM
    Christopoulos, C.
  • Identification of passive macro‐models for high‐speed interconnects operating in non‐TEM conditions
    Chiariello, A.G.; de Magistris, M.; De Tommasi, L.