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Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a... This paper aims to establish a more accurate model for lifetime estimation.Design/methodology/approachFinite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.FindingsA more precise model was found.Originality/valueIt is confirmed that the paper is original. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

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Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0954-0911
DOI
10.1108/ssmt-06-2020-0028
Publisher site
See Article on Publisher Site

Abstract

This paper aims to establish a more accurate model for lifetime estimation.Design/methodology/approachFinite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.FindingsA more precise model was found.Originality/valueIt is confirmed that the paper is original.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: May 17, 2021

Keywords: Electronic devices; Creep strain; Strain energy density; Temperature profile

References