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Thermodynamics of Processing Copper Thick Film Systems in a Reactive Atmosphere

Thermodynamics of Processing Copper Thick Film Systems in a Reactive Atmosphere A major drawback of current copper thickfilm technology is the inefficient removal of the organic binder associated with the dielectric material in the lowoxygen inert gas N2 atmosphere of the furnace. In processing large area andor multilayer substrates, the incomplete binder removal causes deleterious effects which have been well documented. Therefore, it is necessary to remove hydrocarbons and residual carbon from the films in the burnout section of the furnace before the films begin developing their characteristic microstructures. However, the atmosphere currently employed is not capable of removing all the carbon and hydrogen in the form of gaseous oxides. In literature, in addition to furnace modifications, several atmosphere modifications and manipulations have been proposed to achieve optimum properties for the fired films. With few exceptions, the scientific basis for such atmosphere modifications and manipulations has been left either unaddressed or obscure. With this background, this paper examines the feasibility of using a reactive gas mixture in the furnace to achieve efficient organic binder removal. Phase stability diagrams are presented to illustrate the stability of i carbon, ii thick film copper ingredients, iii active phases of resistors, and iv components of glassy and crystalline phases of dielectrics in selected reactive atmospheres. The stability of certain furnace belt constituents is also addressed. Mass balance calculations are shown to demonstrate the extent of carbon removal and copper oxidation in typical nitrogen atmospheres. Based on the interpretation of thermodynamic data and reaction mechanisms involved, a specific H2H2O mixture with nitrogen as the carrier gas is recommended. The approach presented here constitutes a general analytical scheme to understand materialsatmosphere interactions occurring across a temperature range. Several issues in furnace design are also discussed from the standpoint of gassolid reaction kinetics. These deal with the design of gasflow systems that facilitate removal of organic binders. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Thermodynamics of Processing Copper Thick Film Systems in a Reactive Atmosphere

Palanisamy, P.; Sarma, D.H.R.
Microelectronics International , Volume 4 (2): 8 – Feb 1, 1987
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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044270
Publisher site
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Abstract

A major drawback of current copper thickfilm technology is the inefficient removal of the organic binder associated with the dielectric material in the lowoxygen inert gas N2 atmosphere of the furnace. In processing large area andor multilayer substrates, the incomplete binder removal causes deleterious effects which have been well documented. Therefore, it is necessary to remove hydrocarbons and residual carbon from the films in the burnout section of the furnace before the films begin developing their characteristic microstructures. However, the atmosphere currently employed is not capable of removing all the carbon and hydrogen in the form of gaseous oxides. In literature, in addition to furnace modifications, several atmosphere modifications and manipulations have been proposed to achieve optimum properties for the fired films. With few exceptions, the scientific basis for such atmosphere modifications and manipulations has been left either unaddressed or obscure. With this background, this paper examines the feasibility of using a reactive gas mixture in the furnace to achieve efficient organic binder removal. Phase stability diagrams are presented to illustrate the stability of i carbon, ii thick film copper ingredients, iii active phases of resistors, and iv components of glassy and crystalline phases of dielectrics in selected reactive atmospheres. The stability of certain furnace belt constituents is also addressed. Mass balance calculations are shown to demonstrate the extent of carbon removal and copper oxidation in typical nitrogen atmospheres. Based on the interpretation of thermodynamic data and reaction mechanisms involved, a specific H2H2O mixture with nitrogen as the carrier gas is recommended. The approach presented here constitutes a general analytical scheme to understand materialsatmosphere interactions occurring across a temperature range. Several issues in furnace design are also discussed from the standpoint of gassolid reaction kinetics. These deal with the design of gasflow systems that facilitate removal of organic binders.

Journal

Microelectronics International – Emerald Publishing

Published: Feb 1, 1987

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