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Thermal time constants of various substrates of integrated circuits

Thermal time constants of various substrates of integrated circuits The main goal of the work is to show how the kind of substrate and heat sink of integrated circuit or system influences the thermal dynamics of the circuit or system. The investigation leads to the solution of an unsteady state thermal model with analytic method and determination of the thermal time constants of various active and passive substrates and heat sinks. The results show that cheaper materials without any losses of thermal dynamics can replace expensive substrates and heat sinks. Theoretical procedure carried out step by step presents the way of unsteady state temperature computation with analytic method. It can be helpful for determination of the temperature of the chip during unsteady state in any point of the chip, average temperature and thermal time constant of the substrate. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Thermal time constants of various substrates of integrated circuits

Andrzej Kos
Microelectronics International , Volume 18 (3): 6 – Dec 1, 2001
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Publisher
Emerald Publishing
Copyright
Copyright © 2001 MCB UP Ltd. All rights reserved.
ISSN
1356-5362
DOI
10.1108/13565360110405857
Publisher site
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Abstract

The main goal of the work is to show how the kind of substrate and heat sink of integrated circuit or system influences the thermal dynamics of the circuit or system. The investigation leads to the solution of an unsteady state thermal model with analytic method and determination of the thermal time constants of various active and passive substrates and heat sinks. The results show that cheaper materials without any losses of thermal dynamics can replace expensive substrates and heat sinks. Theoretical procedure carried out step by step presents the way of unsteady state temperature computation with analytic method. It can be helpful for determination of the temperature of the chip during unsteady state in any point of the chip, average temperature and thermal time constant of the substrate.

Journal

Microelectronics International – Emerald Publishing

Published: Dec 1, 2001

Keywords: Thermal testing; Integrated circuits

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