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Thermal investigations of microelectronic chip with nonuniform power distribution temperature prediction and thermal placement design optimization

Thermal investigations of microelectronic chip with nonuniform power distribution temperature... This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with nonuniform power dissipation patterns and to determine the optimal locations of power generating sources in silicon chip design layout that leads to the desired junction temperature, Tj. Key thermal parameters investigated are the heat source placement distance, level of heat dissipation, and magnitude of convection heat transfer coefficient. Finite element method FEM is used to investigate the effect of the key parameters. From the FEM results, a multiple linear regression model employing the leastsquare method is developed that relates all three parameters into a single correlation which would predict the maximum junction temperature, Tj,max. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Thermal investigations of microelectronic chip with nonuniform power distribution temperature prediction and thermal placement design optimization

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360410549701
Publisher site
See Article on Publisher Site

Abstract

This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with nonuniform power dissipation patterns and to determine the optimal locations of power generating sources in silicon chip design layout that leads to the desired junction temperature, Tj. Key thermal parameters investigated are the heat source placement distance, level of heat dissipation, and magnitude of convection heat transfer coefficient. Finite element method FEM is used to investigate the effect of the key parameters. From the FEM results, a multiple linear regression model employing the leastsquare method is developed that relates all three parameters into a single correlation which would predict the maximum junction temperature, Tj,max.

Journal

Microelectronics InternationalEmerald Publishing

Published: Dec 1, 2004

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