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Thermal Implications of Using Chip Carriers with Current Laminates

Thermal Implications of Using Chip Carriers with Current Laminates The evolution of epoxy glass fibre PCBs generally accepted by the industry has not produced major developments in laminate technology. Microminiaturisation of components, improved packaging of ICs by chip carriers has made apparent that current laminates will be unable to meet interconnection needs and thermal dissipations. This paper discusses the thermal characteristics of alternative systems using metal cored boards and ceramic substrates. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Thermal Implications of Using Chip Carriers with Current Laminates

Circuit World , Volume 9 (1): 2 – Apr 1, 1982

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043680
Publisher site
See Article on Publisher Site

Abstract

The evolution of epoxy glass fibre PCBs generally accepted by the industry has not produced major developments in laminate technology. Microminiaturisation of components, improved packaging of ICs by chip carriers has made apparent that current laminates will be unable to meet interconnection needs and thermal dissipations. This paper discusses the thermal characteristics of alternative systems using metal cored boards and ceramic substrates.

Journal

Circuit WorldEmerald Publishing

Published: Apr 1, 1982

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