Thermal fatigue cracking of surface mount conductive adhesive joints

Thermal fatigue cracking of surface mount conductive adhesive joints Electrically conductive adhesives are considered to be strong candidates for replacing toxic lead‐based solders. The present work has focused on thermal fatigue cracking of isotropic conductive adhesive (ICA) joints. The initiation and propagation of cracks in the ICA joints were investigated with scanning electron microscopy. A linear elastic finite element analysis has been performed to analyse the stress distribution in the ICA joint and correlate the critical stress concentrations with the observed crack initiation sites. The effect of joint configurations on thermal stresses was also evaluated with numerical calculations. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Thermal fatigue cracking of surface mount conductive adhesive joints

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Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910410517059
Publisher site
See Article on Publisher Site

Abstract

Electrically conductive adhesives are considered to be strong candidates for replacing toxic lead‐based solders. The present work has focused on thermal fatigue cracking of isotropic conductive adhesive (ICA) joints. The initiation and propagation of cracks in the ICA joints were investigated with scanning electron microscopy. A linear elastic finite element analysis has been performed to analyse the stress distribution in the ICA joint and correlate the critical stress concentrations with the observed crack initiation sites. The effect of joint configurations on thermal stresses was also evaluated with numerical calculations.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Apr 1, 2004

Keywords: Isotopes; Surface fitting; Thermal conductivity; Fatigue; Finite element analysis; Stress (materials)

References

  • Reliability evaluation of adhesive bonded SMT components in industrial applications
    Perichaud, M.G.; Deletage, J.Y.; Fremont, H.; Danto, Y.; Faure, C.
  • Analysis of crack growth in solder joints
    Shangguan, D.K.
  • Effects of thermomechanical cycling on lead and lead‐free (SnPb and SnAgCu) surface mount solder joints
    Stam, F.A.; Davitt, E.

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