Electrically conductive adhesives are considered to be strong candidates for replacing toxic lead‐based solders. The present work has focused on thermal fatigue cracking of isotropic conductive adhesive (ICA) joints. The initiation and propagation of cracks in the ICA joints were investigated with scanning electron microscopy. A linear elastic finite element analysis has been performed to analyse the stress distribution in the ICA joint and correlate the critical stress concentrations with the observed crack initiation sites. The effect of joint configurations on thermal stresses was also evaluated with numerical calculations.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Apr 1, 2004
Keywords: Isotopes; Surface fitting; Thermal conductivity; Fatigue; Finite element analysis; Stress (materials)
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