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Thermal degradation of joined thick Au and Al elements

Thermal degradation of joined thick Au and Al elements Investigations were aimed at the evaluation of degradation mechanisms in ultrasonically welded joints of AlSi1 per cent wire 25m in diameter and Au substrate 100m thick, relatively thick elements, exposed to high temperature of 300C up to 100h. Thermally activated Al diffusion into Au generates the formation of intermetallic compounds in the area of the bond interface. With the longer thermal exposure the expansion and transformation of intermetallic compounds is observed. The characteristic intermetallic compounds core is formed, which from one side penetrates into the wire material and from another spreads deeply into the Au substrate up to enhancing band of Kirkendall voids. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Thermal degradation of joined thick Au and Al elements

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360410517102
Publisher site
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Abstract

Investigations were aimed at the evaluation of degradation mechanisms in ultrasonically welded joints of AlSi1 per cent wire 25m in diameter and Au substrate 100m thick, relatively thick elements, exposed to high temperature of 300C up to 100h. Thermally activated Al diffusion into Au generates the formation of intermetallic compounds in the area of the bond interface. With the longer thermal exposure the expansion and transformation of intermetallic compounds is observed. The characteristic intermetallic compounds core is formed, which from one side penetrates into the wire material and from another spreads deeply into the Au substrate up to enhancing band of Kirkendall voids.

Journal

Microelectronics International – Emerald Publishing

Published: Apr 1, 2004

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