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References (8)
-
J. Lau, W. Dauksher, J. Smetana, R. Horsley, D. Shangguan, T. Castello, I. Menis, D. Love, B. Sullivan (2004)
Design for lead‐free solder joint reliability of high‐density packagesSoldering & Surface Mount Technology, 16
-
G. Grossmann, G. Nicoletti, U. Soler (2002)
Results of comparative reliability tests on lead-free solder alloys52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
-
A. Schubert, R. Dudek, E. Auerswald, A. Gollbardt, B. Michel, H. Reichl (2003)
Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation53rd Electronic Components and Technology Conference, 2003. Proceedings.
-
M. Farooq, L. Goldmann, G. Martin, C. Goldsmith, C. Bergeron (2003)
Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modeling53rd Electronic Components and Technology Conference, 2003. Proceedings.
-
J. Lau, N. Hoo, R. Horsley, J. Smetana, D. Shangguan, W. Dauksher, D. Love, I. Menis, B. Sullivan (2004)
Reliability testing and data analysis of lead‐free solder joints for high‐density packagesSoldering & Surface Mount Technology, 16
-
A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, H. Reichl (2002)
Reliability assessment of flip-chip assemblies with lead-free solder joints52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
-
T. Sayama, Takeshi Takayanagi, Yoshiaki Nagai, T. Mori, Qiang Yu (2003)
Evaluation of Microstructural Evolution and Thermal Fatigue Crack Initiation in Sn-Ag-Cu Solder Joints -
F. Stam, E. Davitt (2001)
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder jointsMicroelectron. Reliab., 41
- Publisher
- Emerald Publishing
- Copyright
- Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
- ISSN
- 0954-0911
- DOI
- 10.1108/09540910410537354
- Publisher site
- See Article on Publisher Site
Abstract
The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments. In this work, the thermal cycling reliability of several 2512 chip resistor lead‐free solder joint configurations has been investigated. In an initial study, a comparison has been made between the solder joint reliabilities obtained with components fabricated with both tin‐lead and pure tin solder terminations. In the main portion of the reliability testing, two temperature ranges (−40‐125°C and −40‐150°C) and five different solder alloys have been examined. The investigated solders include the normal eutectic Sn‐Ag‐Cu (SAC) alloy recommended by earlier studies (95.5Sn‐3.8Ag‐0.7Cu), and three variations of the lead‐free ternary SAC alloy that include small quaternary additions of bismuth and indium to enhance fatigue resistance.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Aug 1, 2004
Keywords: Soldering; Joining processes; Product reliability