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Theoretical Considerations on the Thermal Expansion of CopperInvarCopper Metalcore Boards for Surface Mounting Technology

Theoretical Considerations on the Thermal Expansion of CopperInvarCopper Metalcore Boards for... A model for a symmetric threelayer configuration is developed. This model refers to CuInvarCu CIC laminates. Calculated values for the coefficient of thermal expansion CTE are compared with literature values. The model is then extended to symmetric CICMetalcore boards and its prediction is compared with experimental results. Shearing of FR4 is discussed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Theoretical Considerations on the Thermal Expansion of CopperInvarCopper Metalcore Boards for Surface Mounting Technology

Circuit World , Volume 13 (4): 3 – Mar 1, 1987

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References (1)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043888
Publisher site
See Article on Publisher Site

Abstract

A model for a symmetric threelayer configuration is developed. This model refers to CuInvarCu CIC laminates. Calculated values for the coefficient of thermal expansion CTE are compared with literature values. The model is then extended to symmetric CICMetalcore boards and its prediction is compared with experimental results. Shearing of FR4 is discussed.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1987

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