Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

The Use of Capillary Action Measurements for Solderability Improvement

The Use of Capillary Action Measurements for Solderability Improvement This paper describes the tests performed to evaluate the solder capillary action which occurs within a gap between two solderable surfaces during soldering. The goal was to determine the optimal gap distance for maximum capillary flow in the attainment of hermetic solder joints capable of withstanding extreme temperature cycles and various mechanical shocks. One of the test conditions was arranged so that the gap thicknesses would vary while the width of the gaps remained constant. In a second condition, the gap thicknesses remained constant while the gap widths varied. Three plating designs were evaluated. They were nickel plating nickel overplated with gold and nickel, copper intermediate, with tin overplate. The capillary action of all three plating combinations deposited onto aluminium specimens, with the gap configurations previously described, was evaluated. The capillary results were measured with Xray and microstructural data. End use solder joint designs were determined from the capillary results. These designs are shown and they include the best plating design for the application. In addition, an unexpected result was obtained that is useful for testing the solderability of all finishesthe Configured Capillary Solderability Test. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

The Use of Capillary Action Measurements for Solderability Improvement

Soldering & Surface Mount Technology , Volume 3 (3): 6 – Mar 1, 1991

Loading next page...
 
/lp/emerald-publishing/the-use-of-capillary-action-measurements-for-solderability-improvement-ugUz2iYXHX
Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037763
Publisher site
See Article on Publisher Site

Abstract

This paper describes the tests performed to evaluate the solder capillary action which occurs within a gap between two solderable surfaces during soldering. The goal was to determine the optimal gap distance for maximum capillary flow in the attainment of hermetic solder joints capable of withstanding extreme temperature cycles and various mechanical shocks. One of the test conditions was arranged so that the gap thicknesses would vary while the width of the gaps remained constant. In a second condition, the gap thicknesses remained constant while the gap widths varied. Three plating designs were evaluated. They were nickel plating nickel overplated with gold and nickel, copper intermediate, with tin overplate. The capillary action of all three plating combinations deposited onto aluminium specimens, with the gap configurations previously described, was evaluated. The capillary results were measured with Xray and microstructural data. End use solder joint designs were determined from the capillary results. These designs are shown and they include the best plating design for the application. In addition, an unexpected result was obtained that is useful for testing the solderability of all finishesthe Configured Capillary Solderability Test.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Mar 1, 1991

There are no references for this article.