The trend towards high speed digital processing has stimulated the need for new substrate materials with superior electrical properties for multilayer printed wiring board PWB applications. Two important electrical substrate parameters are dielectric constant and dissipation factor. This study examines the effect of combining different resin and fibre systems for altering or possibly improving electrical performance. Resin systems studied include FR4, cyanate ester and polytetrafluoroethylene. Materials used for reinforcement include Eglass, Sglass and polytetrafluoroethylene based fibres. Results of the electrical and thermal characterisation work on the test vehicles built based on the mixed resin and fibre systems are reported.
Circuit World – Emerald Publishing
Published: Mar 1, 1991