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The Resistance of SpaceQuality Solder Joints to Thermal Fatigue

The Resistance of SpaceQuality Solder Joints to Thermal Fatigue An evaluation programme involving the extensive thermal cycling of componentassembled printed circuit boards has been undertaken to assess the suitability of ESAapproved handsoldering techniques for use on longlife satellites. The modes of joint degradation are discussed and the metallurgical changes that result from material thermal expansion mismatch and repeated strain within the solder alloy 63 tin, 37 lead are highlighted by photomicroscopy. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

The Resistance of SpaceQuality Solder Joints to Thermal Fatigue

Circuit World , Volume 6 (1): 12 – Apr 1, 1979

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References (2)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043602
Publisher site
See Article on Publisher Site

Abstract

An evaluation programme involving the extensive thermal cycling of componentassembled printed circuit boards has been undertaken to assess the suitability of ESAapproved handsoldering techniques for use on longlife satellites. The modes of joint degradation are discussed and the metallurgical changes that result from material thermal expansion mismatch and repeated strain within the solder alloy 63 tin, 37 lead are highlighted by photomicroscopy.

Journal

Circuit WorldEmerald Publishing

Published: Apr 1, 1979

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