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The preparation of anisotropic conductive paste and its application in FOB interconnection

The preparation of anisotropic conductive paste and its application in FOB interconnection The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system.Design/methodology/approachDifferential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints and 90º peel adhesion were tested before and after high temperature and high humidity test (85°C, 85% humidity), thermal cycling (−45°C∼125°C, 30min/cycle) and pressure cooker test (PCT, 121°C, 100% humidity 2 atm) to evaluate the flex on board (FOB) interconnection reliability.FindingsIt is found that FOB test vehicles have been successfully bonded by using ACP for the first time. And the ACP bonding joint of FOB has good reliability and can meet the requirements of FOB interconnection. Compared with conventional anisotropic conductive film (ACF), this ACP interconnection provides higher adhesion strength, higher joint current carrying capability and higher reliability performance and lower cost for FOB interconnection.Originality/valueACP is applied in the interconnection of FOB. It has the higher reliability performance and lower cost for than the conventional ACF. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

The preparation of anisotropic conductive paste and its application in FOB interconnection

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References (15)

Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
1356-5362
eISSN
1356-5362
DOI
10.1108/mi-11-2022-0187
Publisher site
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Abstract

The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system.Design/methodology/approachDifferential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints and 90º peel adhesion were tested before and after high temperature and high humidity test (85°C, 85% humidity), thermal cycling (−45°C∼125°C, 30min/cycle) and pressure cooker test (PCT, 121°C, 100% humidity 2 atm) to evaluate the flex on board (FOB) interconnection reliability.FindingsIt is found that FOB test vehicles have been successfully bonded by using ACP for the first time. And the ACP bonding joint of FOB has good reliability and can meet the requirements of FOB interconnection. Compared with conventional anisotropic conductive film (ACF), this ACP interconnection provides higher adhesion strength, higher joint current carrying capability and higher reliability performance and lower cost for FOB interconnection.Originality/valueACP is applied in the interconnection of FOB. It has the higher reliability performance and lower cost for than the conventional ACF.

Journal

Microelectronics International – Emerald Publishing

Published: Mar 17, 2023

Keywords: Anisotropic conductive paste; FOB; Interconnection; Reliability

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