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The investigation of the capillary flow of underfill materials

The investigation of the capillary flow of underfill materials The underfilling of flip chip components with the encapsulant is based on the principles of capillary flow. A reasonable understanding of capillary flow and an effective estimate of the encapsulant's flow time will help develop a robust process. Factors which may influence the encapsulant's flow rate and its variation include the material type (viscosity, wetting characteristics, silicon particle size, etc.), the aging of the material, the substrate preheat temperature, the chemical composition and texture of the flow surface, standoff height, and the presence of obstructions (solder bumps).A screening experiment through the use of orthogonal array was conducted to determine the factors which would have a significant effect on the encapsulant's flow rate. The screening experiments served as a precursor to subsequent process modeling and the identification of a robust process design. Comprehensive experiments were then performed to further investigate the flow behavior of the underfill materials with realistic properties. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

The investigation of the capillary flow of underfill materials

C.Y. Huang
Microelectronics International , Volume 19 (1): 7 – Apr 1, 2002
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Publisher
Emerald Publishing
Copyright
Copyright © 2002 MCB UP Ltd. All rights reserved.
ISSN
1356-5362
DOI
10.1108/13565360210417754
Publisher site
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Abstract

The underfilling of flip chip components with the encapsulant is based on the principles of capillary flow. A reasonable understanding of capillary flow and an effective estimate of the encapsulant's flow time will help develop a robust process. Factors which may influence the encapsulant's flow rate and its variation include the material type (viscosity, wetting characteristics, silicon particle size, etc.), the aging of the material, the substrate preheat temperature, the chemical composition and texture of the flow surface, standoff height, and the presence of obstructions (solder bumps).A screening experiment through the use of orthogonal array was conducted to determine the factors which would have a significant effect on the encapsulant's flow rate. The screening experiments served as a precursor to subsequent process modeling and the identification of a robust process design. Comprehensive experiments were then performed to further investigate the flow behavior of the underfill materials with realistic properties.

Journal

Microelectronics International – Emerald Publishing

Published: Apr 1, 2002

Keywords: Flip chip; Underfill; Encapsulation

References

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    Anderson, B.
  • Non‐polymerised fluids
    Barrer, R.M.
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    Caroline, B.H.; Martin, V.
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    Fosberry, J.; Srihari, K.
  • Towards a better understanding of underfill encapsulation for flip chip technology: proposed developments for the future
    Ken, G.; Matthew, W.; David, B.; Peter, O.
  • The effects of new trends in flip chip packages on automating the underfill process
    Newbold, J.; Levis, A.
  • Dispensing flip chip underfill process problems and solutions
    Norris, M.J.
  • The partial aliasing patterns for Taguchi's L12 orthogonal array
    Tsai, H.T.
  • Number representation method for obtaining two‐factor interaction columns in two‐level orthogonal arrays
    Tsai, H.T.