Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

The impact of process parameters on gold elimination from soldered connector assemblies

The impact of process parameters on gold elimination from soldered connector assemblies Gold coatings are used on connector structures to maintain suitable solderability of the underlying Ni coating layer as well as to prevent surface corrosion during service. However, the likelihood of Au embrittlement in connector solder joints must be minimized by eliminating much of the Au plating from the surfaces using a hot solder dipping or “wicking” procedure prior to final assembly. It was observed that Au removal was most effective by using a double wicking process. Also, a higher soldering temperature improved the efficiency of the Au removal process. A longer soldering time during the wicking process did not appear to offer an appreciable improvement in Au removal. Because the wicking procedure was a manual process, it was found to be operator dependent. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

The impact of process parameters on gold elimination from soldered connector assemblies

P.T. Vianco; A.C. Kilgo
Soldering & Surface Mount Technology , Volume 12 (2): 8 – Aug 1, 2000
Download PDF
7 pages

Loading next page...
 
/lp/emerald-publishing/the-impact-of-process-parameters-on-gold-elimination-from-soldered-WMH9ZP0gat
Publisher
Emerald Publishing
Copyright
Copyright © 2000 MCB UP Ltd. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910010331400
Publisher site
See Article on Publisher Site

Abstract

Gold coatings are used on connector structures to maintain suitable solderability of the underlying Ni coating layer as well as to prevent surface corrosion during service. However, the likelihood of Au embrittlement in connector solder joints must be minimized by eliminating much of the Au plating from the surfaces using a hot solder dipping or “wicking” procedure prior to final assembly. It was observed that Au removal was most effective by using a double wicking process. Also, a higher soldering temperature improved the efficiency of the Au removal process. A longer soldering time during the wicking process did not appear to offer an appreciable improvement in Au removal. Because the wicking procedure was a manual process, it was found to be operator dependent.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Aug 1, 2000

Keywords: Connectors; Soldering; Gold; Embrittlement

References

  • Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold
    Mei, Z. et al.
  • MC4395 connector solder joint analysis
    Vianco, P
  • MC4395 connector solder joint analysis – part II
    Vianco, P