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The Impact of Metal Cored Multilayer Boards for Surface Mounted Devices

The Impact of Metal Cored Multilayer Boards for Surface Mounted Devices The new generation of SMDs LCCs can now be mounted on multilayer printed circuits which offer a thermal expansion similar to that of ceramic. In addition, a thermal management solution is available as a means of removing heat generated by the devices. This paper discusses the new development in multilayer board design construction and component assembly associated with metal core boards. New methods of selective plating component footprints are also discussed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

The Impact of Metal Cored Multilayer Boards for Surface Mounted Devices

Circuit World , Volume 13 (4): 3 – Mar 1, 1987

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb043894
Publisher site
See Article on Publisher Site

Abstract

The new generation of SMDs LCCs can now be mounted on multilayer printed circuits which offer a thermal expansion similar to that of ceramic. In addition, a thermal management solution is available as a means of removing heat generated by the devices. This paper discusses the new development in multilayer board design construction and component assembly associated with metal core boards. New methods of selective plating component footprints are also discussed.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1987

There are no references for this article.