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The evaluation of different base materials for high density flip chip on flex applications

The evaluation of different base materials for high density flip chip on flex applications This paper presents the results from the evaluation of different types of flexible substrates for high‐density flip chip application. In this work two different types of base materials were used, epoxiglass (EG) and polyimide (PI). According to previous tests the type of conductive particles in the adhesive seems to be one of the key factors in high‐density interconnections. The adhesive selected for these tests was a composite of epoxy matrix and high content of isolated soft metal‐coated polymer particles. Two different test structures with contact areas of 50 × 50ॖm and 50 × 90ॖm were compared. The total amount of contacts in one IC was approximately 200 and the effective pitch size was 80ॖm. The contact resistances were measured by four‐point method and the continuity by daisy chain structure. The reliability of the flip chip interconnections was tested in thermal cycling and humidity tests. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

The evaluation of different base materials for high density flip chip on flex applications

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Publisher
Emerald Publishing
Copyright
Copyright © 2001 MCB UP Ltd. All rights reserved.
ISSN
1356-5362
DOI
10.1108/13565360110405866
Publisher site
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Abstract

This paper presents the results from the evaluation of different types of flexible substrates for high‐density flip chip application. In this work two different types of base materials were used, epoxiglass (EG) and polyimide (PI). According to previous tests the type of conductive particles in the adhesive seems to be one of the key factors in high‐density interconnections. The adhesive selected for these tests was a composite of epoxy matrix and high content of isolated soft metal‐coated polymer particles. Two different test structures with contact areas of 50 × 50ॖm and 50 × 90ॖm were compared. The total amount of contacts in one IC was approximately 200 and the effective pitch size was 80ॖm. The contact resistances were measured by four‐point method and the continuity by daisy chain structure. The reliability of the flip chip interconnections was tested in thermal cycling and humidity tests.

Journal

Microelectronics International – Emerald Publishing

Published: Dec 1, 2001

Keywords: Flip chip; Bonding

References

  • Adhesive flip chip bonding on flexible substrates
    Aschenbrenner, R.; Mießner, R.; Reichl, H.
  • Conductive Model Ansotropical Adhesives
    Määttänen, J.,; Palm, P.; Tuominen, A.
  • Development of flip chip on flex process using ansisotropically conductive adhesives
    Määttänen, J.; Palm, P.; Tuominen, A.; Puhakka, K.
  • Reliability of the flip chip on flex application using anisotropically conductive adhesives, EMIT‐2K
    Määttänen, J.; Palm, P.; Tuominen, A.; Puhakka, K.
  • Development of high density flip chip on flex process using anisotropically conductive adhesives
    Määttänen, J.; Palm, P.; Tuominen, A.; Ristolainen, E.
  • Flexible Circuit Technology – An Overview
    Mahesh, G.V.; Boustedt, K.; Brox, B.
  • Reliability of high density flip chip on flex interconnection
    Palm, P.; Määttänen, J.; Tuominen A.; Ristolainen, E.
  • Solder‐filled anisotropically conductive adhesives in electronic interconnections
    Savolainen, P.
  • Assembly and reliability of flip chip on boards using ACA’s or eutectic solder with underfill
    Zhong, Z.