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The Effects of Ultrasonic Cleaning on Device DegradationAn Update

The Effects of Ultrasonic Cleaning on Device DegradationAn Update The effects of ultrasonic agitation on electronic components during PCB cleaning has long been the subject of controversy. This paper summarises the results of a series of studies into these effects for a range of components using CFC, aqueous and semiaqueous cleaning media. The variations with exposure time and power density under various ultrasonic stress conditions loose, mounted on PCBs, or on purposebuilt test boards are discussed. The results are encouraging and suggest that there is a large margin of safety when employing currently accepted regimes of operation and good quality components. However, the strong dependence of the damage accumulation on power density emphasises the need to specify and tightly control the power density used. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

The Effects of Ultrasonic Cleaning on Device DegradationAn Update

Circuit World , Volume 17 (4): 6 – Mar 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046146
Publisher site
See Article on Publisher Site

Abstract

The effects of ultrasonic agitation on electronic components during PCB cleaning has long been the subject of controversy. This paper summarises the results of a series of studies into these effects for a range of components using CFC, aqueous and semiaqueous cleaning media. The variations with exposure time and power density under various ultrasonic stress conditions loose, mounted on PCBs, or on purposebuilt test boards are discussed. The results are encouraging and suggest that there is a large margin of safety when employing currently accepted regimes of operation and good quality components. However, the strong dependence of the damage accumulation on power density emphasises the need to specify and tightly control the power density used.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1991

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