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The Effects of Ultrasonic Cleaning on Device Degradation

The Effects of Ultrasonic Cleaning on Device Degradation An investigation of the use of ultrasonic agitation for cleaning printed circuit boards using CFCbased solvents has shown that, under the standard conditions required to produce clean assemblies, no damage will occur to the components studied. Damage can only be induced by use of anomalously longer times or higher power densities. In all cases in which damage has been induced, it is of a purely mechanical nature due to fatigue, and is located on the device bondwires andor the package legs. Cleaning using CFCbased solvents under standard ultrasonic conditions of power density and time etc. is readily achieved within 2 minutes, even with a minimum standoff height. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

The Effects of Ultrasonic Cleaning on Device Degradation

Richards, B.P.; Burton, P.; Footner, P.K.
Circuit World , Volume 16 (3): 6 – Feb 1, 1990
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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046082
Publisher site
See Article on Publisher Site

Abstract

An investigation of the use of ultrasonic agitation for cleaning printed circuit boards using CFCbased solvents has shown that, under the standard conditions required to produce clean assemblies, no damage will occur to the components studied. Damage can only be induced by use of anomalously longer times or higher power densities. In all cases in which damage has been induced, it is of a purely mechanical nature due to fatigue, and is located on the device bondwires andor the package legs. Cleaning using CFCbased solvents under standard ultrasonic conditions of power density and time etc. is readily achieved within 2 minutes, even with a minimum standoff height.

Journal

Circuit World – Emerald Publishing

Published: Feb 1, 1990

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