Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

The Effect of Ageing on the Microstructure of 6040 Tinlead Solders

The Effect of Ageing on the Microstructure of 6040 Tinlead Solders Studies have been made of ageing effects, both at room temperature and at 125C, on the microstructure of 6040 tinlead solders. A comparison was made of the effect of ageing on slow and rapidly cooled matrices. Precipitation of tin within lead dendrites was observed to occur very rapidly after solidification of the alloy. Subsequently the precipitates coarsened markedly over a period of a few weeks. The matrix of the alloy also coarsened at room temperature over this period. At elevated temperatures a similar sequence of events occurred, but substantially faster. The microstructural origins of the known loss in mechanical strength of solders with ageing are discussed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

The Effect of Ageing on the Microstructure of 6040 Tinlead Solders

Loading next page...
 
/lp/emerald-publishing/the-effect-of-ageing-on-the-microstructure-of-6040-tinlead-solders-jUcjetngyQ
Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037741
Publisher site
See Article on Publisher Site

Abstract

Studies have been made of ageing effects, both at room temperature and at 125C, on the microstructure of 6040 tinlead solders. A comparison was made of the effect of ageing on slow and rapidly cooled matrices. Precipitation of tin within lead dendrites was observed to occur very rapidly after solidification of the alloy. Subsequently the precipitates coarsened markedly over a period of a few weeks. The matrix of the alloy also coarsened at room temperature over this period. At elevated temperatures a similar sequence of events occurred, but substantially faster. The microstructural origins of the known loss in mechanical strength of solders with ageing are discussed.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jan 1, 1991

There are no references for this article.