The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths

The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints... Purpose – The purpose of this paper is to compare the growth kinetics of interfacial intermetallic compound (IMC) layer and its effect on the tensile strength of two solder (Sn3.0Ag0.5Cu and Sn0.4Co0.7Cu) joints. Design/methodology/approach – The samples annealed, respectively, at 85, 120 and 150°C up to 1,000 h were tensile tested and their cross‐sections were observed by scanning electron micrography. Findings – The results showed that, for both solder joints, an approximately linear reduction in tensile joint strength with an increase in the IMC layers' thickness occurred. The tensile strength of Cu/Sn3.0Ag0.5Cu solder joints is slightly better than that of Cu/Sn‐0.7Co‐0.4Cu solder joints under analogous aging conditions. In addition, the growth kinetics of the overall interfacial IMC layer in Sn0.4Co0.7Cu solder joints can be simply described by the classical growth kinetic theory for solid‐state diffusion with an activation energy of 2,996.85 J/mol and interdiffusion constant of 4.15×0 −17 m 2 /s which are relatively lower, compared with Sn3.0Ag0.5Cu solder on copper with 14,167.8 J/mol and 65.33×10 −17 m 2 /s, respectively. Originality/value – The paper is of value in evaluating the growth kinetics of Sn3.0Ag0.5Cu and Sn0.4Co0.7Cu solder joints, and in discussing and contrasting the influence of IMC growth on their tensile strength. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths

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Publisher
Emerald Publishing
Copyright
Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910810885660
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to compare the growth kinetics of interfacial intermetallic compound (IMC) layer and its effect on the tensile strength of two solder (Sn3.0Ag0.5Cu and Sn0.4Co0.7Cu) joints. Design/methodology/approach – The samples annealed, respectively, at 85, 120 and 150°C up to 1,000 h were tensile tested and their cross‐sections were observed by scanning electron micrography. Findings – The results showed that, for both solder joints, an approximately linear reduction in tensile joint strength with an increase in the IMC layers' thickness occurred. The tensile strength of Cu/Sn3.0Ag0.5Cu solder joints is slightly better than that of Cu/Sn‐0.7Co‐0.4Cu solder joints under analogous aging conditions. In addition, the growth kinetics of the overall interfacial IMC layer in Sn0.4Co0.7Cu solder joints can be simply described by the classical growth kinetic theory for solid‐state diffusion with an activation energy of 2,996.85 J/mol and interdiffusion constant of 4.15×0 −17 m 2 /s which are relatively lower, compared with Sn3.0Ag0.5Cu solder on copper with 14,167.8 J/mol and 65.33×10 −17 m 2 /s, respectively. Originality/value – The paper is of value in evaluating the growth kinetics of Sn3.0Ag0.5Cu and Sn0.4Co0.7Cu solder joints, and in discussing and contrasting the influence of IMC growth on their tensile strength.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jun 27, 2008

Keywords: Solders; Tensile strength; Surface mount technology; Joining processes

References

  • Interfacial reactions between lead‐free solders and common base materials
    Laurila, T.; Vuorinen, V.; Kivilahti, J.K.
  • Physics and materials challenges for lead‐free solders
    Tu, K.N.; Gusak, A.M.

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