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The Chemical Design and Optimisation of a Nonrosin, Watersoluble Flux Solder Paste

The Chemical Design and Optimisation of a Nonrosin, Watersoluble Flux Solder Paste This paper describes the approach used by the authors to select the flux materials for a simple watersoluble solder paste flux formulation, what those materials were, and how they interacted to give the correct properties. Consistency of formulation and performance are discussed with emphasis on the need for adequate process parameter control as with any formulation. With this watersoluble paste formulation various circuit card designs were successfully built possessing 25mil pitch, and larger, components. The cards were cleaned in aqueous cleaners and passed IBM standard insulation resistance testing. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

The Chemical Design and Optimisation of a Nonrosin, Watersoluble Flux Solder Paste

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037791
Publisher site
See Article on Publisher Site

Abstract

This paper describes the approach used by the authors to select the flux materials for a simple watersoluble solder paste flux formulation, what those materials were, and how they interacted to give the correct properties. Consistency of formulation and performance are discussed with emphasis on the need for adequate process parameter control as with any formulation. With this watersoluble paste formulation various circuit card designs were successfully built possessing 25mil pitch, and larger, components. The cards were cleaned in aqueous cleaners and passed IBM standard insulation resistance testing.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Feb 1, 1992

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