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Testing on dynamic behavior of PBGA assembly by considering fixed‐modes

Testing on dynamic behavior of PBGA assembly by considering fixed‐modes Purpose – The purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic packaging and to investigate the dynamic behavior of PBGA assembly by considering fixed‐modes for design and reliability evaluation of PBGA packaging. Design/methodology/approach – A PBGA assembly prototype with different structure and material parameters is designed and manufactured. The modal distribution under excitation cycling can be tested by hammering test. The dynamic test about the PBGA assembly prototype can be implemented with different structure characteristics, materials parameters and fixed‐modes. To illustrate the validity of experimental test, the numerical simulation for the dynamic behavior of the PBGA assembly prototype is developed by using finite element method. Comparison between the experimental results and simulation can illustrate the validity of the experimental test and finite element modeling each other. Findings – The modal distribution test shows the influence of structure characteristics, materials parameters and fixed‐modes of PBGA assembly board. The changing trends of the dynamic modal characteristics during the dynamic excitation can be obtained with different structure characteristics, materials parameters and fixed‐modes of PBGA assembly. Test shows that the fixed location of the assembly board is the most important factor to influence the first frequency and modal deformation of the assembly board. Higher frequency and smaller deformation can be obtained when there are more constraints in printed circuit board. Research limitations/implications – The numerical model is a compendious model by predigesting structure. The research on more accurate mathematical model of the PBGA assembly prototype is a future work. Practical implications – It can imply the dynamics of PBGA assembly. It builds a basis for future work for design and reliability evaluation of PBGA packaging. Originality/value – This paper provides useful information about the dynamic behavior of PBGA assembly with different structure characteristics, materials parameters and fixed‐modes. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Testing on dynamic behavior of PBGA assembly by considering fixed‐modes

Ping Yang; Zixia Chen
Microelectronics International , Volume 28 (2): 7 – May 10, 2011
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Publisher
Emerald Publishing
Copyright
Copyright © 2011 Emerald Group Publishing Limited. All rights reserved.
ISSN
1356-5362
DOI
10.1108/13565361111127313
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic packaging and to investigate the dynamic behavior of PBGA assembly by considering fixed‐modes for design and reliability evaluation of PBGA packaging. Design/methodology/approach – A PBGA assembly prototype with different structure and material parameters is designed and manufactured. The modal distribution under excitation cycling can be tested by hammering test. The dynamic test about the PBGA assembly prototype can be implemented with different structure characteristics, materials parameters and fixed‐modes. To illustrate the validity of experimental test, the numerical simulation for the dynamic behavior of the PBGA assembly prototype is developed by using finite element method. Comparison between the experimental results and simulation can illustrate the validity of the experimental test and finite element modeling each other. Findings – The modal distribution test shows the influence of structure characteristics, materials parameters and fixed‐modes of PBGA assembly board. The changing trends of the dynamic modal characteristics during the dynamic excitation can be obtained with different structure characteristics, materials parameters and fixed‐modes of PBGA assembly. Test shows that the fixed location of the assembly board is the most important factor to influence the first frequency and modal deformation of the assembly board. Higher frequency and smaller deformation can be obtained when there are more constraints in printed circuit board. Research limitations/implications – The numerical model is a compendious model by predigesting structure. The research on more accurate mathematical model of the PBGA assembly prototype is a future work. Practical implications – It can imply the dynamics of PBGA assembly. It builds a basis for future work for design and reliability evaluation of PBGA packaging. Originality/value – This paper provides useful information about the dynamic behavior of PBGA assembly with different structure characteristics, materials parameters and fixed‐modes.

Journal

Microelectronics International – Emerald Publishing

Published: May 10, 2011

Keywords: Packaging; Electronics industry; Thermodynamic properties; Modelling

References

  • Vibration fatigue reliability of BGA‐IC package with Pb‐free solder and Pb‐Sn solder
    Kim, Y.B.; Noguchi, H.; Amagai, M.
  • Reliability of BGA and CSP on metal‐backed printed circuit boards in harsh environments
    Lall, P.; Islam, N.; Evans, J.; Suhling, J.
  • Design and reliability in electronic packaging including power temperature cycling and vibration effects
    Nickerson, M.D.; Desai, C.S.
  • Plastic ball grid array solder joint reliability for avionics applications
    Qi, H.; Osterman, M.; Pecht, M.
  • Under‐filled BGA solder joint vibration fatigue damage
    Wong, T.E.; Palmieri, F.W.
  • Experimental approach and evaluation on dynamic reliability of PBGA assembly
    Yang, P.; Chen, Z.
  • Physical mechanism of interfacial thermal resistance in electronic packaging based on a mixed MD/FE model
    Yang, P.; Liao, N.
  • Research on parametric analysis for stress of PBGA solder joint under shock load
    Yang, P.; Zhang, J.
  • Approach on thermal strain behaviour of PBGA solder joints
    Yang, P.; Shen, C.; Liao, N.
  • Test and reliability analysis of PBGA assemblies under random vibration
    Yang, Q.; Wang, Z.; Lim, G.H.; Pang, H.L.J.; Yap, F.F.; Lin, R.