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Thermal cycling tests for surface mounted components are usually taken around a mean temperature of approximately 35C e.g., 55C to 125C 40C to 110C. To test the effect of different maximum temperatures thermal cycling tests using a lower temperature of 55C have been conducted with aluminathick film zeroohm jumper chips with nickel barriers. These are connected in series chains and wave soldered on to FR4 test coupons 128 chipscoupon. The test regimes used were 55C to 5C 65C 95C, 110C and 125C. Resistance changes before and after cycling were observed at room temperature. After 100 cycles changes of approximately 200 m were observed against a total resistance of 55 . However, more detailed examination showed that a top temperature of 95C gives optimum results with a total change over 100 cycles of 49.
Microelectronics International – Emerald Publishing
Published: Mar 1, 1987
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