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Techniques for the Inspection of Flip Chip Solder Bonded Devices

Techniques for the Inspection of Flip Chip Solder Bonded Devices After a brief introduction to the advantages and method of construction of flip chip solder bond devices, this paper looks at different techniques that can be used to inspect these devices at various stages in their construction. These techniques include optical, infrared, acoustic and electron microscopy, radiograph, electrical and tensile testing. The advantages and limitations of each of the techniques are discussed and an outline inspection schedule is suggested. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Techniques for the Inspection of Flip Chip Solder Bonded Devices

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044374
Publisher site
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Abstract

After a brief introduction to the advantages and method of construction of flip chip solder bond devices, this paper looks at different techniques that can be used to inspect these devices at various stages in their construction. These techniques include optical, infrared, acoustic and electron microscopy, radiograph, electrical and tensile testing. The advantages and limitations of each of the techniques are discussed and an outline inspection schedule is suggested.

Journal

Microelectronics International – Emerald Publishing

Published: Feb 1, 1989

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