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TBGA reliability in telecom environment

TBGA reliability in telecom environment Owing to the demands of increasing I/O counts and thermal performance BGA (ball grid array) type packaging concepts are rapidly gaining in popularity. Use of various modelling tools is an obvious way to save resources by discarding the most unreliable solutions before wasting testing capacity. A testing procedure was created and then evaluated. Two components were assembled on test boards and the assembled boards were temperature cycled from –40 to +125°C. Parametric 3D FE‐models (finite element) of the components were generated and models were verified. Environmental conditions were added to assess the lifetimes of the assemblies in the targeted environment. Some differences in the TBGAs board level reliability were found. With all contributions of parameters the first failures happened after 1,000 cycles. FE‐modelling combined with accelerated stress testing proved to be an effective tool for test result analysis and for rationalising the test sequences. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

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References (6)

Publisher
Emerald Publishing
Copyright
Copyright © 2000 MCB UP Ltd. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910010331509
Publisher site
See Article on Publisher Site

Abstract

Owing to the demands of increasing I/O counts and thermal performance BGA (ball grid array) type packaging concepts are rapidly gaining in popularity. Use of various modelling tools is an obvious way to save resources by discarding the most unreliable solutions before wasting testing capacity. A testing procedure was created and then evaluated. Two components were assembled on test boards and the assembled boards were temperature cycled from –40 to +125°C. Parametric 3D FE‐models (finite element) of the components were generated and models were verified. Environmental conditions were added to assess the lifetimes of the assemblies in the targeted environment. Some differences in the TBGAs board level reliability were found. With all contributions of parameters the first failures happened after 1,000 cycles. FE‐modelling combined with accelerated stress testing proved to be an effective tool for test result analysis and for rationalising the test sequences.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Aug 1, 2000

Keywords: Finite element method; Reliability; Tape ball grid array

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