A ball grid array (BGA) is a surface‐mount device and is processed in a standard surface‐mount (SM) assembly line. However, there are some special features which make it different from other assemblies. The peculiarities of PCB layout, screen printing, placement, soldering, and inspection in BGA processing are presented. The failures of BGA assembly during ramp up and series production start‐up are analysed in detail. An assembly quality better than 1dpm was achieved. The scale of repair is determined by the electrical quality of the devices. If small packages with higher pincount and better electrical performance are required, the µ BGA is a sound choice. Compared with other high pincount packages with a small formfactor as TAB, flip‐chip and chip on board, the µ BGA may be processed in a standard SM assembly line. The results of µ BGA‐assembly feasibility studies are discussed.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Apr 1, 1998
Keywords: Ball grid array; Chip size package; Printed circuit board; Surface mount assembly
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