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Substrate integrated packaging for RFapplications

Substrate integrated packaging for RFapplications In this paper, Substrate Integrated Packaging SIP based on thin film multilayer technology is presented. Coplanar waveguide feedthroughs calculated with 3DFinite Differential Methods were manufactured using a ceramic or silicon carrier, gold conductors and polyimide as dielectric. The substrate integrated packages were realized with metallic frames and lids mounted on the thin film circuitry. Sparameter measurements show the superior quality of the feedthroughs. To verify the new packaging concept, a 10GHz and a 58GHz amplifier module were realized. From these modules the potential of the SIPtechnology is demonstrated. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Substrate integrated packaging for RFapplications

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360010306056
Publisher site
See Article on Publisher Site

Abstract

In this paper, Substrate Integrated Packaging SIP based on thin film multilayer technology is presented. Coplanar waveguide feedthroughs calculated with 3DFinite Differential Methods were manufactured using a ceramic or silicon carrier, gold conductors and polyimide as dielectric. The substrate integrated packages were realized with metallic frames and lids mounted on the thin film circuitry. Sparameter measurements show the superior quality of the feedthroughs. To verify the new packaging concept, a 10GHz and a 58GHz amplifier module were realized. From these modules the potential of the SIPtechnology is demonstrated.

Journal

Microelectronics InternationalEmerald Publishing

Published: Apr 1, 2000

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