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/lp/emerald-publishing/substrate-integrated-packaging-for-rfapplications-4Xig7u0pdv
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565360010306056
- Publisher site
- See Article on Publisher Site
Abstract
In this paper, Substrate Integrated Packaging SIP based on thin film multilayer technology is presented. Coplanar waveguide feedthroughs calculated with 3DFinite Differential Methods were manufactured using a ceramic or silicon carrier, gold conductors and polyimide as dielectric. The substrate integrated packages were realized with metallic frames and lids mounted on the thin film circuitry. Sparameter measurements show the superior quality of the feedthroughs. To verify the new packaging concept, a 10GHz and a 58GHz amplifier module were realized. From these modules the potential of the SIPtechnology is demonstrated.
Journal
Microelectronics International – Emerald Publishing
Published: Apr 1, 2000