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Substrate Bowing of Multilayer Thick Film Circuits

Substrate Bowing of Multilayer Thick Film Circuits The production of interconnection modules with an increasing number of layers leads to problems in the planarity of modules and therefore in the chip mounting process. The present paper discusses a model based on the theory of plates which allows the calculation of bowing degree in relation to the coefficients of thermal expansion i, Young's moduli Ei, the thicknesses hi, and the softening point of the glassy components in the thick film pastes. The calculated values are compared with experimental data for substrates built up as entirely covered model substrates of up to 7 layers of one type of paste conductor and dielectric, respectively and of alternately printed layers. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Substrate Bowing of Multilayer Thick Film Circuits

Microelectronics International , Volume 3 (3): 3 – Mar 1, 1986

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044243
Publisher site
See Article on Publisher Site

Abstract

The production of interconnection modules with an increasing number of layers leads to problems in the planarity of modules and therefore in the chip mounting process. The present paper discusses a model based on the theory of plates which allows the calculation of bowing degree in relation to the coefficients of thermal expansion i, Young's moduli Ei, the thicknesses hi, and the softening point of the glassy components in the thick film pastes. The calculated values are compared with experimental data for substrates built up as entirely covered model substrates of up to 7 layers of one type of paste conductor and dielectric, respectively and of alternately printed layers.

Journal

Microelectronics InternationalEmerald Publishing

Published: Mar 1, 1986

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