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/lp/emerald-publishing/substrate-bowing-of-multilayer-thick-film-circuits-z0F2IHEZ0k
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/eb044243
- Publisher site
- See Article on Publisher Site
Abstract
The production of interconnection modules with an increasing number of layers leads to problems in the planarity of modules and therefore in the chip mounting process. The present paper discusses a model based on the theory of plates which allows the calculation of bowing degree in relation to the coefficients of thermal expansion i, Young's moduli Ei, the thicknesses hi, and the softening point of the glassy components in the thick film pastes. The calculated values are compared with experimental data for substrates built up as entirely covered model substrates of up to 7 layers of one type of paste conductor and dielectric, respectively and of alternately printed layers.
Journal
Microelectronics International – Emerald Publishing
Published: Mar 1, 1986