Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Study on process technique of PCBs with ladder conductive lines

Study on process technique of PCBs with ladder conductive lines Purpose – This paper aims to develop an ideal technique for the preparation of print circuit boards (PCBs) with ladder conductive lines on practical industrial process lines. Design/methodology/approach – First, the raw materials of ladder copper-clad laminates were prepared by plating double-sided copper-clad laminates with vertical plating line. Second, etching compensation experiments were designed and conducted to set up the relationships between etching compensation and width of conductive lines on ladder line print circuit boards (LLPCBs). Third, to evaluate the process technique for the preparation of LLPCBs through etching compensation, verification experiments were designed and conducted on a practical industrial process line, and the quality of lines on LLPCBs was observed and evaluated. Findings – Under the judgment of the quality of conductive lines on LLPCBs as well as the feasibility with a practical industrial process line, the process technique for the preparation of LLPCBs with etching compensation is a simple and reliable method which has the potential to be applied in the industry. Originality/value – It is the first successful report of a new method that produces LLPCBs with etching compensation and has the potential to be applied in the industry. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Study on process technique of PCBs with ladder conductive lines

Loading next page...
 
/lp/emerald-publishing/study-on-process-technique-of-pcbs-with-ladder-conductive-lines-yCvnbSo7BG

References (4)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/CW-09-2014-0036
Publisher site
See Article on Publisher Site

Abstract

Purpose – This paper aims to develop an ideal technique for the preparation of print circuit boards (PCBs) with ladder conductive lines on practical industrial process lines. Design/methodology/approach – First, the raw materials of ladder copper-clad laminates were prepared by plating double-sided copper-clad laminates with vertical plating line. Second, etching compensation experiments were designed and conducted to set up the relationships between etching compensation and width of conductive lines on ladder line print circuit boards (LLPCBs). Third, to evaluate the process technique for the preparation of LLPCBs through etching compensation, verification experiments were designed and conducted on a practical industrial process line, and the quality of lines on LLPCBs was observed and evaluated. Findings – Under the judgment of the quality of conductive lines on LLPCBs as well as the feasibility with a practical industrial process line, the process technique for the preparation of LLPCBs with etching compensation is a simple and reliable method which has the potential to be applied in the industry. Originality/value – It is the first successful report of a new method that produces LLPCBs with etching compensation and has the potential to be applied in the industry.

Journal

Circuit WorldEmerald Publishing

Published: Feb 2, 2015

There are no references for this article.