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Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with... PurposeThis paper aims to investigate the effect of solder alloying with a small amount of La and Y on bond formation with the Si and Cu substrates.Design/methodology/approachBi2La and Bi2Y solders were studied. Soldering was performed using a fluxless method in air and with ultrasonic activation.FindingsIt was found that in the process of ultrasonic soldering, the La and Y were distributed at the interface with Si and Cu substrates, which enhanced the bond formation. Addition of La or Y elements in a Bi-based solder also ensured wetting of non-metallic materials such as Si, Al2O3 and SiC ceramics.Originality/valueThe addition of lanthanides offers a method for ensuring wetting of non-metallic materials. The bond with Si was of an adhesive character without the formation of a new contact interlayer. This resulted in lower shear strength of the bond with Si (8-10 MPa). The shear strength of the bond with a Cu substrate was 22-30 MPa. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

Kolenak, Roman
Soldering & Surface Mount Technology , Volume 29 (3): 12 – Jun 5, 2017
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References (21)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/SSMT-08-2016-0018
Publisher site
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Abstract

PurposeThis paper aims to investigate the effect of solder alloying with a small amount of La and Y on bond formation with the Si and Cu substrates.Design/methodology/approachBi2La and Bi2Y solders were studied. Soldering was performed using a fluxless method in air and with ultrasonic activation.FindingsIt was found that in the process of ultrasonic soldering, the La and Y were distributed at the interface with Si and Cu substrates, which enhanced the bond formation. Addition of La or Y elements in a Bi-based solder also ensured wetting of non-metallic materials such as Si, Al2O3 and SiC ceramics.Originality/valueThe addition of lanthanides offers a method for ensuring wetting of non-metallic materials. The bond with Si was of an adhesive character without the formation of a new contact interlayer. This resulted in lower shear strength of the bond with Si (8-10 MPa). The shear strength of the bond with a Cu substrate was 22-30 MPa.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jun 5, 2017

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