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Silicon pressure sensors with a thick film periphery

Silicon pressure sensors with a thick film periphery Silicon piezoresistive pressure sensor dies are mounted on a ceramic substrate where the signal conditioning electronics are implemented in thick film technology. In this paper some of these techniques, e.g. special attachment and bonding requirements, methods for temperature compensation, the principles of parameter adjustment, and encapsulation, are presented. For illustration two examples are described. The first is a multipoint monitoring system with 720 measuring points in a test mattress. The second example is a family of industrial pressure transducers. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Silicon pressure sensors with a thick film periphery

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565369810233122
Publisher site
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Abstract

Silicon piezoresistive pressure sensor dies are mounted on a ceramic substrate where the signal conditioning electronics are implemented in thick film technology. In this paper some of these techniques, e.g. special attachment and bonding requirements, methods for temperature compensation, the principles of parameter adjustment, and encapsulation, are presented. For illustration two examples are described. The first is a multipoint monitoring system with 720 measuring points in a test mattress. The second example is a family of industrial pressure transducers.

Journal

Microelectronics International – Emerald Publishing

Published: Dec 1, 1998

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