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Screening Synchronously Occurred Multiple Abnormal Quality Characteristics in a Silicon Wafer Slicing Process

Screening Synchronously Occurred Multiple Abnormal Quality Characteristics in a Silicon Wafer... Silicon wafer slicing manufacturing process exhibits several characteristics. They are: (1) the product type is small batch production, (2) saw cutting must be very precise, (3) the process run time is long, and (4) inspecting samples is difficult. Furthermore, the process involves several synchronously occurred multiple quality characteristics, such as thickness (THK), bow and warp, which must be closely monitored and controlled. Synchronously monitoring multiple quality characteristics is more expensive than monitoring a single quality characteristic in the manufacturing process. The sizes of inspected samples in the existing process are difficult to maintain the quality control chart. Grey situation decision method is used to screen the worst quality control chart. Grey situation decision method is used to screen the worst quality characteristic from the synchronously occurred multiple quality characteristics to monitor the process. Finally, a case study is presented to demonstrate the feasibility and effectiveness of proposed decision method. The exponential weighted moving average (EWMA) control chart is used to verify that the process quality is more reliable. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Asian Journal on Quality Emerald Publishing

Screening Synchronously Occurred Multiple Abnormal Quality Characteristics in a Silicon Wafer Slicing Process

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Publisher
Emerald Publishing
Copyright
Copyright © 2002 MCB UP Ltd. All rights reserved.
ISSN
1598-2688
DOI
10.1108/15982688200200004
Publisher site
See Article on Publisher Site

Abstract

Silicon wafer slicing manufacturing process exhibits several characteristics. They are: (1) the product type is small batch production, (2) saw cutting must be very precise, (3) the process run time is long, and (4) inspecting samples is difficult. Furthermore, the process involves several synchronously occurred multiple quality characteristics, such as thickness (THK), bow and warp, which must be closely monitored and controlled. Synchronously monitoring multiple quality characteristics is more expensive than monitoring a single quality characteristic in the manufacturing process. The sizes of inspected samples in the existing process are difficult to maintain the quality control chart. Grey situation decision method is used to screen the worst quality control chart. Grey situation decision method is used to screen the worst quality characteristic from the synchronously occurred multiple quality characteristics to monitor the process. Finally, a case study is presented to demonstrate the feasibility and effectiveness of proposed decision method. The exponential weighted moving average (EWMA) control chart is used to verify that the process quality is more reliable.

Journal

Asian Journal on QualityEmerald Publishing

Published: Apr 17, 2002

Keywords: Silicon wafer manufacturing; Multiple quality characteristics; Grey situation decision; WWMA control chart

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