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Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre‐strained eutectic Sn‐3.5Ag solder joints

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation... Purpose – To understand the roles of service‐related parameters, such as imposed cyclic strain amplitude and cyclic strain rate, on the stress relaxation behaviour of eutectic Sn‐Ag solder joints. Design/methodology/approach – Cyclic shear straining with associated stress relaxation at the shear strain extremes imposed was carried out on pre‐strained eutectic Sn‐Ag solder joints with various cyclic shear straining conditions. Results from such experiments were compared with previously reported findings from monotonic shear straining and stress relaxation tests. Findings – At higher testing temperatures with a larger cyclic strain amplitude, stress states realized at the subsequent cycle are comparable with, or even gradually increase on, those experienced at the previous cycle, especially after few cycles. The maximum shear stress obtained at each cycle and residual stress during stress relaxation are strongly affected by cyclic strain rate. Stress relaxation during subsequent cycles of straining was found to be strongly dependent on the test temperature, and the imposed cyclic strain amplitude and cyclic strain rate. Originality/value – In this paper, the experiments were carried out on eutectic Sn‐Ag solder joints with about a 100 μ m joint thickness, which are, therefore, representative of those used in microelectronics. Also, there is no systematic study reporting the effects of cyclic straining conditions on the stress relaxation behaviour of eutectic Sn‐Ag solder for this joint configuration in the published literature. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre‐strained eutectic Sn‐3.5Ag solder joints

Soldering & Surface Mount Technology , Volume 18 (1): 10 – Jan 1, 2006

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Publisher
Emerald Publishing
Copyright
Copyright © 2006 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910610647080
Publisher site
See Article on Publisher Site

Abstract

Purpose – To understand the roles of service‐related parameters, such as imposed cyclic strain amplitude and cyclic strain rate, on the stress relaxation behaviour of eutectic Sn‐Ag solder joints. Design/methodology/approach – Cyclic shear straining with associated stress relaxation at the shear strain extremes imposed was carried out on pre‐strained eutectic Sn‐Ag solder joints with various cyclic shear straining conditions. Results from such experiments were compared with previously reported findings from monotonic shear straining and stress relaxation tests. Findings – At higher testing temperatures with a larger cyclic strain amplitude, stress states realized at the subsequent cycle are comparable with, or even gradually increase on, those experienced at the previous cycle, especially after few cycles. The maximum shear stress obtained at each cycle and residual stress during stress relaxation are strongly affected by cyclic strain rate. Stress relaxation during subsequent cycles of straining was found to be strongly dependent on the test temperature, and the imposed cyclic strain amplitude and cyclic strain rate. Originality/value – In this paper, the experiments were carried out on eutectic Sn‐Ag solder joints with about a 100 μ m joint thickness, which are, therefore, representative of those used in microelectronics. Also, there is no systematic study reporting the effects of cyclic straining conditions on the stress relaxation behaviour of eutectic Sn‐Ag solder for this joint configuration in the published literature.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jan 1, 2006

Keywords: Cyclic loading; Stress; Soldering; Strain measurement

References

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