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Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic... The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.Design/methodology/approachSeveral accelerated shear stress tests under different stress amplitudes and aging temperatures were performed.FindingsIt was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration.Originality valueIt is confirmed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

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Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0954-0911
eISSN
0954-0911
DOI
10.1108/ssmt-07-2020-0029
Publisher site
See Article on Publisher Site

Abstract

The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.Design/methodology/approachSeveral accelerated shear stress tests under different stress amplitudes and aging temperatures were performed.FindingsIt was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration.Originality valueIt is confirmed.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jul 12, 2021

Keywords: Thermal fatigue; Solder joint; Aging temperature; Thermomechanical fatigue model

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