Research on Increasing the Production Yield Rate by Six Sigma Method: A Case of SMT Process of Main Board

Research on Increasing the Production Yield Rate by Six Sigma Method: A Case of SMT Process of... Face the process yield rate improvements of motherboard, although general enterprises finish deployment goal of each functions by overall quality managements, through quality improvement methods, industry engineering methods, plan‐do‐check‐act (PDCA) methods and other improvement solutions, but it is only can be improved partially and unable to enhance the yield rate of product to the target. It only can takes one step ahead to enhance the process yield rate of motherboard with six sigma (6 ॣ) overall DMAIC process and tactics. This research aimed to use six sigma quality improvement tactics by DMAIC systematic procedure and tactics, and find the key factors that effect to the process yield rate of surface mount technology. It also identified the keys input and process and output index to satisfy customer requirements and internal process index. The results showed that the major effective factors by fishbone and process failure modes and effects analysis (PFMEA). If the index of input and output that can be quantified, the optimum parameter can be found through design of experiment to ensure that the process is stable. If the factor of input and output that cannot be quantified, we found out the effective countermeasure by Mind_Mapping, make sure whole processes can be controlled stably, to reach the high product quality and enhance the customer satisfaction. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Asian Journal on Quality Emerald Publishing

Research on Increasing the Production Yield Rate by Six Sigma Method: A Case of SMT Process of Main Board

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Publisher
Emerald Publishing
Copyright
Copyright © 2009 Emerald Group Publishing Limited. All rights reserved.
ISSN
1598-2688
DOI
10.1108/15982680980000624
Publisher site
See Article on Publisher Site

Abstract

Face the process yield rate improvements of motherboard, although general enterprises finish deployment goal of each functions by overall quality managements, through quality improvement methods, industry engineering methods, plan‐do‐check‐act (PDCA) methods and other improvement solutions, but it is only can be improved partially and unable to enhance the yield rate of product to the target. It only can takes one step ahead to enhance the process yield rate of motherboard with six sigma (6 ॣ) overall DMAIC process and tactics. This research aimed to use six sigma quality improvement tactics by DMAIC systematic procedure and tactics, and find the key factors that effect to the process yield rate of surface mount technology. It also identified the keys input and process and output index to satisfy customer requirements and internal process index. The results showed that the major effective factors by fishbone and process failure modes and effects analysis (PFMEA). If the index of input and output that can be quantified, the optimum parameter can be found through design of experiment to ensure that the process is stable. If the factor of input and output that cannot be quantified, we found out the effective countermeasure by Mind_Mapping, make sure whole processes can be controlled stably, to reach the high product quality and enhance the customer satisfaction.

Journal

Asian Journal on QualityEmerald Publishing

Published: Apr 17, 2009

Keywords: Six Sigma; Surface mount; Yield rate; Process failure modes; Effects analysis

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